WEBVTT

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Hello everyone!

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Welcome to stream PCB YouTube channel.

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My name is Avital and in the previous video we talked about return current and its modeling and simulation

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on cadence piecewise.

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The purpose of this video is to give you better understanding of return current path.

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For example, if there is power plane or number of power planes between signal and its return path,

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we will try to understand which path return current will follow.

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Apart from that, we will try to understand what will happen to instantaneous impedance due to power

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plane.

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We will use couple of simulations and modeling on cadence piecewise.

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So let's get started.

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First we will try to understand the problem of changing reference plane.

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In this very first example where we have signal and its return path.

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And as we discussed in the previous video, there is capacitive coupling between them.

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Now as signal travels down the transmission line, return current will flow through these tiny capacitors.

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Now in another case, let's suppose we are dealing with multilayer PCB and we have introduced a power

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plane or floating plane between signal and its return path.

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Now we don't have any idea how current will return to source.

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So let's talk about it.

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But before we try to understand different ways to visualize return current, let's recall two important

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points I have discussed earlier.

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First point is for DC current.

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DC current follows the path which has lowest resistance and then it return to source.

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But similarly for AC current, it follows the path which has lowest impedance or inductance and then

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is return to source.

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These two points will help us to understand what will happen to return current if we add a power plan.

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Now let's try to understand how return current flows in this case.

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So first method is capacitive coupling waves like a two layer board return current flows through capacitive

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coupling between signal and return plane underneath.

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Similarly, in this case, return current flows from signal layer to layer two due to capacitive coupling,

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and then from layer two to layer three due to their capacitive coupling, as you can see on this figure.

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Another way to think about return current while switching between reference plane is eddy current way.

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So eddy current is a loop current which induces in nearby conductor due to change in magnetic field.

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And the direction of current will be opposite of that.

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Let's try to see that in our three layer model, in which as soon as signal starts travelling, due

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to that, there will be change in electromagnetic field which will induce loop current on adjacent conductor.

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Now same thing will happen on the other side of the source, which will cause another loop current flow

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at the other surface of the plane.

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And when they meet at the corner of the plane, it completes the circuit.

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Now in the next step, we are going to talk about what will be the effect of that capacitive coupling

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between planes and signal layer.

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Either it should be low or it should be high.

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So for that I'm going to use a piecewise model.

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So as you can see on the screen on this Spice model I'm using 50 ohm.

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0.5 nanosecond time delay transmission line, which are connected in series.

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And here we have a step response of one volt which is further connected to 200 ohm source resistor.

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And I have terminated this model with a 50 ohm resistor.

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Now here you are seeing couple of more transmission line.

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So you can imagine that as a plane underneath this signal layer.

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So this is our 50 ohm signal layer.

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And underneath I have created a very less impedance plane which has almost zero time delay.

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And another plane that you can imagine on this model is ground plane which is here.

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So I'm talking about coupling between signal layer which is this capacitive coupling which is ten nanofarad

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here and plane underneath.

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And then coupling between plane and ground plane which is C10.

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In, so everything will change when we vary C8 and C10 on these two waveforms.

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So this is the current waveform of signal.

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And here you will see the return current which is going back to source.

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All right so this example is low capacitive coupling between planes.

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So what what should be the expected results of low capacitive coupling.

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First one is impedance discontinuity.

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So if there is low coupling there will be high impedance which will cause.

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So in case of impedance discontinuity we will see reflections on the line.

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Now out of these two waveform which one has more reflection.

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Obviously the second one has more reflection compared to this one.

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Alright so let's see the results.

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So as you can see this is our low coupling capacitor model.

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And we can see.

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So this is transmission line which is on the signal layer.

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So green waveform is little bit stable.

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But blue waveform has so much reflection on the line due to low coupling.

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Now let's see the other example.

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So I've created another model.

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And here I have increased the capacitive coupling to one microfarad from ten nanofarad.

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Alright.

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Due to that increment in coupling, the current will be flowing from signal layer to power plane or

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plane underneath and from that plane to ground and going back to our source.

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So due to this there will be very less impedance discontinuity and which will cause low reflection.

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So let's check out that as well.

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So as you can see and this is the time delay that we have introduced.

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As you can see green is the waveform of our signal.

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And red is the waveform of return current through capacitive coupling.

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And you can see the clear difference.

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There is more reflection on return current due to capacitive coupling.

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And this is our signal return current.

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All right.

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And there is also some reflection because we have added plane underneath.

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We'll try to understand that in more detail.

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What will happen or what driver will see when we add a plane under the signal layer.

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All right.

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So from that we got to know the capacitive coupling between planes should be higher.

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Or you can say there should be tight coupling between the planes and signal layer.

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Right.

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So then we'll get more positive results compared to the low capacitive coupling.

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Again I would recommend just play along these values.

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Either change the value of capacitance, change the value of time delay impedance, add more transmission

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line on this model and see what will happen on the return current waveform.

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I will attach this project.

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You can download it from description and let me know in the comment section in case of any question.

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Now after discussing models and two methods.

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Let's talk about what impedance the driver will see into the transmission line.

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If there is a plane between signal and ground.

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So from the two methods, one is the eddy current way and coupling capacitors way that we got to know

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the current will be flowing in series.

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So that means the total impedance between layer one and layer three will be is equal to the impedance

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between layer one and layer two, plus the impedance between layer two and layer three.

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All right.

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So till here we got to know about return current path if we insert a plane.

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Now what we'll do with all this information.

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What is the application of that.

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So let's talk about the very first point.

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So first point is by choosing the coupling between these layers we can control the width of the impedance

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of impedance control track.

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For example the smaller the impedance between plane two and three or Z.

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Two, three.

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The thicker the signal track will be.

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So sometimes we face this problem while we are routing some very thinner tracks which are not manufacturable

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in real world.

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So to make them thicker, we have to implement this method.

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We have to reduce the coupling between planes so we can make them more thicker and manufacturable.

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So this is the first application.

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And the second application is selection of layer stackup.

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So as you can see we have two layer stackup.

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And the clear difference is one.

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One has the little bit thicker Prepreg and Stackup two has little bit thinner prepreg which is 0.1 and

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0.2mm.

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So the case one is let's suppose we are going to route our high speed track or impedance control track

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on the top layer.

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So in that case which layer Stackup is good.

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Obviously the second layer stack up.

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So in this case second layer Stackup is good for Routing high speed track.

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If you are going to route it on the top layer, because there will be more coupling between top layer

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and inner copper layer, which is ground.

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All right.

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So generally for four layer we use this configuration ground signal power and signal.

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All right.

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Now another case is let's suppose I am planning to route high speed tracks or impedance controlled track

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on the bottom layer.

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So for that case which layer Stackup is better.

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So we have to simply add up this thickness and this thickness.

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And we can compare which one is higher.

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So if we add up this thickness it will be approx 1.2 something.

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And this will be approx 1.3.

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So obviously in that case we'll going to if we are routing on the bottom layer.

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Then first layer stack up is good for that.

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All right.

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So this is another application where you can implement this.

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Whatever we have learned in this video to estimate if you are routing on inner layer, top layer or

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bottom layer, which Stackup is better.

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Right.

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If you have a power plane or, you know, couple of more planes between signal and ground.

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Now let's talk about how we can estimate the impedance between planes.

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So for that we use simple formula which is z naught is equal to 377 divided by square root of epsilon

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r which should be effective dielectric constant multiplied by height or gap between the planes divided

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by its width.

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So using this formula we can able to estimate the impedance between the planes.

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Now let's conclude this video with this statement that to maintain rail collapse or to minimize rail

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collapse, and to put return current path close to signal layer, these middle planes or power planes

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should be tightly coupled with ground.
